Trust Automation offers a customizable 300mm Ultra High Vacuum Robot that is a precision, in-chamber, wafer handling and positioning system configured for metrology processes. The UHV Robot is capable of X and Y precision to +/- 2.5 μm over the full wafer envelope and less than +/- 0.2 μm for the 50mm z axis. Coordinated with the 3 axes of the UHV robot an additional 5 axes of related motion can be incorporated.
The UHV robot interfaces with the chamber and application specific end effector (EE) offering a range of capabilities that can be customized to meet varying requirements and demands of any OEM semiconductor equipment manufacturer.
We provide ground-up custom solutions for our customers. Call us or fill out the form below to discuss your specific needs and we’ll design and manufacture a system for you.
